Semiconductor waveguide photodetector

ABSTRACT

A semiconductor waveguide photodetector with higher light receiving efficiency, wherein single mode light is transmitted as the insensitive light signal. The semiconductor waveguide photodetector comprises a 1×1 multi mode interference (MMI) light waveguide region, and a couple of single mode waveguide regions, each of which is connected with each end of the multi mode region. The length of the multi mode waveguide region is about 100 μm and the lengths of the single mode waveguide regions are about 10 μm. The width of multimode waveguide region is 6 μm and those of single mode waveguide regions are 1.5 μm.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a semiconductor waveguide photodetector with high detection sensitivity, which acts also as a filter applicable to the wavelength division multiple communication.

[0003] 2. Description of the Prior Art

[0004] Recently, the optical fiber communication technology has been progressing as one of the technologies for large capacity and high speed transmission. Particularly, the semiconductor photodetector, amongst various optical devices supporting the optical communication technology, are of great interest, because it is one of the key devices for implementing a long distance communication, which receives directly the transmitted signal and converts the light signal to electrical signal.

[0005] There are some variations in the semiconductor photodetector. Particularly, the semiconductor waveguide photodetector is characterized in that it is packaged in a package similar to a semiconductor laser and it is integrated easily with other waveguide optical devices or passive waveguides.

[0006] Generally, the light receiving region is designed as a multimode waveguide for improving the receiving efficiency of light signal. Such a multimode waveguide for the semiconductor waveguide photodetector is reported, for example, in IEEE Journal of Quantum Electronics Vol. 28 No. 12, 1992, p2728 to p2735, by K. Kato.

[0007] If it is the only purpose to receive optical signal, any single mode waveguide is not necessary. However, it is desirable that the waveguide photodetector behaves also as a filter as well as a detector. In case of the wavelength division multiple communication, a semiconductor photodetector is provided with the filtering function which passes the wavelength longer than the sensitive wavelength of the photodetector and absorbs the wavelength within the sensitive band. The above-mentioned function requires a single mode waveguide which propagates single mode light.

[0008] As described above, it is preferable that the light receiving region be designed as a multimode waveguide in view of the receiving efficiency of light signal. On the other hand, a single mode waveguide is required in order to obtain the filtering function for the wavelength division multiple communication. These two conditions are contradictory.

SUMMARY OF THE INVENTION

[0009] Therefore, an object of the present invention is to provide a semiconductor photodetector with higher light receiving efficiency, which has also a function of optical filter.

[0010] In accordance with the present invention, there is provided a semiconductor photodetector which outputs single mode light, which comprises a light waveguide structure including a multi mode waveguide region.

[0011] The multi mode waveguide region may be a 1×1 multi mode interference light waveguide.

[0012] The semiconductor waveguide photodetector may comprises: a multi mode waveguide region; and a couple of single mode waveguide regions, each of which is connected with each end of the multi mode waveguide region.

[0013] The width of the multi mode waveguide region is made wider than the width of the single mode waveguide regions.

[0014] The above-mentioned structure behaves as a multi mode waveguide light receiving region for the received light and behaves as a single mode waveguide optical filter for the transmitted light.

[0015] As described above, the semiconductor waveguide photodetector of the present invention is highly sensitive, because the main light receiving region is a multi mode waveguide. Further, the multi mode waveguide is the 1×1 multi mode interference (MMI) waveguide. Therefore, the semiconductor waveguide photodetector functions also as a filter suitable for the waveguide division multiple communication.

BRIEF EXPLANATION OF THE DRAWINGS

[0016]FIG. 1 is a perspective illustration of the semiconductor waveguide photodetector of the present invention.

[0017]FIG. 2A is a cross sectional view taken on line I-I′ of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

[0018]FIG. 2B is a cross sectional view taken on line II-II′ of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

[0019]FIG. 3 is an illustration for explaining the first step of the manufacturing of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

[0020]FIG. 4 is an illustration for explaining the second step of the manufacturing of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

[0021]FIG. 5 is an illustration for explaining the third step of the manufacturing of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

[0022]FIG. 6 is an illustration for explaining the forth step of the manufacturing of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

[0023]FIG. 7 is an illustration for explaining the fifth step of the manufacturing of the semiconductor waveguide photodetector of the present invention as shown in FIG. 1.

PREFERRED EMBODIMENT OF THE INVENTION

[0024] Referring to the drawings, the embodiment of the present invention is explained in detail.

[0025] As shown in FIG. 1, for example, the photodetector of the present invention absorbs 1.3 μm band light and passes through 1.55 μm band light, if wavelength division multiple signal composed of 1.3 μm band light and 1.55 μm band light is incident. The semiconductor waveguide photodetector comprises multi mode waveguide region 1, and single mode waveguide regions 2 and 3, each of which is connected with each end of the multi mode region 1. The length of the multi mode waveguide region 1 is about 100 μm and the length of the single mode waveguide regions 2 and 3 is about 10 μm. Accordingly, the length of the whole device is about 120 μm. Multi mode waveguide region 1 is designed as a 1×1 multi mode interference (MMI) light waveguide. FIG. 2A is a cross sectional view taken on line I-I′ to show the layered structure of the multi mode wave guide region, and FIG. 2B is a cross sectional view taken on line II-II′ to show the layered structure of the single mode wave guide region. Both of the layer structures are the same except the widths of the waveguides. The width WI of multimode waveguide region 1 is 6 μm and those of single mode waveguide regions 2 and 3 are 1.5 μm.

[0026] Next, referring to FIG. 3 to FIG. 7, the fabrication method of the semiconductor waveguide photodetector of the present invention is explained. As shown in FIG. 3, n-InP buffer layer 24 (about 200 nm thickness), 1.4 μm composition InGaAsP layer 29 (about 100 nm thickness), and p-InP cladding layer 26 (about 200 nm thickness) are grown sequentially on n-InP substrate 23, by metal organic vapor phase epitaxy (MOVPE).

[0027] Then, as shown in FIG. 4, mask 31 for etching is formed on p-InP cladding layer 26 by using the conventional photolithography. Then, as shown in FIG. 5, the unmasked part of p-InP cladding region 26, 1.4 μm composition InGaAsP layer 29, and n-InP buffer layer 24 are etched by using the reactive ion etching (RIE). Next, after depositing SiO₂ on the whole surface by using the conventional thermal chemical vapor deposition (CVD), the SiO₂ is etched to form mask 32 for depositing a burying layer 27 which surround mesa stripe by using selective epitaxy, as shown in FIG. 6. Then, as shown in FIG. 7, p-InP burying layer 27 (about 2 μm thickness) and p-InGaAs capping layer 28 (about 200 μm thickness) are grown by using MOVPE.

[0028] Then, the backside of the device is polished, the substrate electrode and the surface electrode are metalized by the conventional sputtering, and finally the anti-reflection coating layer is deposited on the cleaved facets of the mesa stripe.

[0029] The semiconductor waveguide photodetector of the present invention comprises a multi mode waveguide region 1, as shown in FIG. 1. The multi mode waveguide region 1 is designed to behaves as a 1×1 MMI light waveguide.

[0030] In the conventional technology, a narrow waveguide with about 1.5 μm width along the whole waveguide is required to transmit single mode light.

[0031] However, 1×1 MMI light waveguide can transmits single mode light, even if it is three times or more wider than the conventional single mode waveguide, according to the principle of multi mode interference. Thus, the single mode light can be transmitted, though the main light receiving region is made of the above-mentioned multimode waveguide which is highly sensitive. Accordingly, the semiconductor waveguide photodetector functions as a filter suitable for the waveguide division multiple communication.

[0032] The waveguide of the present invention confines strongly both the TE mode and the TM mode. Therefore, the light receiving sensitivity is polarization independent. Further, it is suitable for the integrated optical devices, because its structure is simple.

[0033] Although the present invention has been shown and described with respect to the best mode embodiment thereof, it should be understood by those skilled in the art that the foregoing and various other changes, omissions, and additions in the form and detail thereof may be made therein without departing from the spirit and scope of the present invention.

[0034] For example, the present invention is applicable for the other layer structure instead of the buried structure of the present invention. The wavelength may be 1.3 μm or in the near infrared or visible region, without limiting it to 1.55 μm.

[0035] The method of epitaxy may be MBE, instead of MOVPE and the method of forming the mesa may be wet etching, instead of RIE. 

What is claimed is:
 1. A semiconductor waveguide photodetector wherein single mode light is outputted, which comprises a light waveguide structure including a multi mode waveguide region.
 2. The semiconductor waveguide photodetector according to claim 1 , wherein said multi mode waveguide region is a 1×1 multi mode interference light waveguide.
 3. The semiconductor waveguide photodetector according to claim 1 , wherein said light waveguide structure comprises: said multi mode waveguide region; and a couple of single mode waveguide regions, each of which is connected with each end of said multi mode waveguide region.
 4. The semiconductor waveguide photodetector according to claim 2 , wherein each end of said 1×1 multi mode interference light waveguide is connected with a single mode waveguide region.
 5. The semiconductor waveguide photodetector according to claim 3 , wherein the width of said multi mode waveguide region is wider than the width of said couple of single mode waveguide regions.
 6. The semiconductor waveguide photodetector according to claim 4 , wherein the width of said 1×1 multi mode interference light waveguide is wider than the width of said couple of single mode waveguide region. 